IC Packaging Engineer

Maxim Integrated Products is looking for an IC package development engineer, to be part of our team to develop leading edge package and process solutions, taking them from concept definition to high volume production.  This is an opportunity work in an innovative environment with advance packaging technologies. You will work closely with multiple business/design units and manufacturing facilities to develop and implement the project plan, manage projects from concept through development, qualification to production.



Responsibilities Overall design & development of high performance, cost effective packages utilizing several technologies, for example wire bond, flip chip and stacked die technologies amongst others. Participate in material selection and qualifications to ensure product performance, reliability and cost targets are met. Work with cross-functional teams to develop processes, packages and modules. Interact with internal and external customers, subcontractors and equipment and material suppliers. Provide guidance during technology transfer to manufacturing engineering at production facilities. Travel to Asia is required (10-20%).

Requirements BS/MS in Material/ Mechanical/ Electronics Engineering 5-8 years' experience in IC package Engineering preferred. Knowledge of statistical tools, DOE, SPC, FMEA and 8D methodology Excellent analytical, verbal and communication skills.

Click here to apply for this job
https://maximic.ats.hrsmart.com/cgi-bin/pm/click.cgi?job_id=285&site_id=35